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Material Sciences and Spintronics

MultiSpin.AI ensures collaboration among material scientists and spintronics experts (BIU, INESC-MN, UCLouvain, SpinEdge) to simulate and co-define device layers’ materials, magnetic, and electrical characteristics. This includes the fabrication and patterning of SLMMS and M2TJs.

Nanofabrication and Nanomagnetism

With the help of experts in nanodevice simulation, characterization, and testing (BIU, UCLouvain, INESC-MN, I-FEVS), MultiSpin.AI works on the characterization of SLMMS and M2TJs properties through numerical simulations and experimental measurements for iterating the device design.

Numerical Simulations and Modelling

With our partners’ expertise in simulating spintronics devices (SpinEdge, UCLouvain), MultiSpin.AI integrates insights via SPICE modelling with CMOS peripheral drivers to tailor electrical circuits to PoC specifications.

Electronic Engineering and AI Development

Our electronic engineers, spintronics physicists, and AI experts (SpinEdge, UCLouvain, I-FEVS, VUB-CLAIRE) work to design and develop PCB prototypes, including driver and control software and the co-development of AI algorithms with spintronic hardware.

Ethical Considerations and Human-Centered Design

Bringing together the expertise of AI algorithm developers, spintronics physicists, IoT specialists, AI ethicists, and human-centred designers, our collaborative effort will focus on training and testing Proof of Concept (PoC) demonstrators like MNIST digit recognition and mobility applications. MultiSpin.AI ensures the integration of human-centred and ethical design principles to ensure unbiased and socially robust results.

Market contribution

With our different areas of expertise, MultiSpin.AI aims to contribute to the manufacture and commercial availability of high-performance, cost-effective, and energy-efficient inference chips and boost Europe’s competitiveness in semiconductor technologies through evidence-based recommendations.

Keep up with our latest work and engagements 

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